Daily Stock Analysis, KLIC, Kulicke and Soffa Industries Inc, priceseries

Kulicke and Soffa Industries Inc. Daily Stock Analysis
Stock Information
Open
26.00
Close
26.35
High
26.36
Low
26.00
Previous Close
26.15
Daily Price Gain
0.20
YTD High
26.95
YTD High Date
Nov 15, 2019
YTD Low
18.61
YTD Low Date
May 29, 2019
YTD Price Change
6.39
YTD Gain
32.01%
52 Week High
26.95
52 Week High Date
Nov 15, 2019
52 Week Low
17.40
52 Week Low Date
Dec 24, 2018
52 Week Price Change
7.19
52 Week Gain
37.51%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
Jan 10. 2017
15.95
Feb 24. 2017
19.55
31 Trading Days
22.60%
Link
LONG
Apr 19. 2017
19.49
May 3. 2017
20.90
10 Trading Days
7.21%
Link
LONG
Jul 7. 2017
19.34
Jul 27. 2017
20.96
14 Trading Days
8.40%
Link
LONG
Nov 3. 2017
22.05
Nov 27. 2017
25.85
15 Trading Days
17.25%
Link
LONG
Mar 6. 2018
22.61
Mar 23. 2018
24.52
13 Trading Days
8.46%
Link
LONG
Jul 5. 2018
23.56
Jul 23. 2018
26.20
12 Trading Days
11.18%
Link
LONG
Apr 1. 2019
22.17
Apr 22. 2019
23.51
14 Trading Days
6.03%
Link
LONG
Jun 3. 2019
19.53
Jun 17. 2019
20.62
10 Trading Days
5.61%
Link
LONG
Sep 4. 2019
20.80
Sep 27. 2019
23.19
17 Trading Days
11.48%
Link
Company Information
Stock Symbol
KLIC
Exchange
NasdaqGS
Company URL
http://www.kns.com
Company Phone
2157846000
CEO
Fusen Ernie Chen
Headquarters
-
Business Address
23A SERANGOON NORTH AVENUE 5, #01-01, SINGAPORE, SINGAPORE 554369
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor Equipment & Materials
CIK
0000056978
About

Kulicke & Soffa Industries, Inc. provides semiconductor packaging and electronic assembly solutions for the automotive, consumer, communications, computing and industrial segments. It operates through the following segments: Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders, heavy wire wedge bonders, advanced packaging and surface mount technology solutions. The Expendable Tools segment produces and sells a variety of tools for a broad range of semiconductor packaging applications including capillaries, bonding wedges and saw blades. The company was founded by Frederick W. Kulicke and Albert Soffa in 1951 and is headquartered in Singapore.

Description

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold, silver alloy, or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; wafer level bonders, which mechanically applies bumps to dies for some variants of the flip chip assembly process; and wedge bonders to connect semiconductor chips for the power packages, power hybrids, and automotive modules. This segment also provides advanced packaging with adaptive machine analytics chip-to-substrate bonders for flip chip and thermo-compression bonding applications; and electronic assembly solutions, as well as spare parts, equipment repair, maintenance and servicing, equipment upgrading, and training services. The Expendable Tools segment offers various expendable tools for a range of semiconductor packaging applications. This segment's products include capillaries for use in ball bonders, as well as gold wire bonding; bonding wedges for use in heavy wire wedge bonders; dicing blades that are used for cutting silicon wafers into individual semiconductor dies. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.