Daily Stock Analysis, IMOS, ChipMOS Technologies Inc, priceseries

ChipMOS Technologies Inc. Daily Stock Analysis
Stock Information
Open
38.89
Close
38.70
High
39.00
Low
38.53
Previous Close
39.11
Daily Price Gain
-0.41
YTD High
44.72
YTD High Date
Sep 3, 2021
YTD Low
23.20
YTD Low Date
Jan 6, 2021
YTD Price Change
15.20
YTD Gain
64.67%
52 Week High
44.72
52 Week High Date
Sep 3, 2021
52 Week Low
17.51
52 Week Low Date
Sep 25, 2020
52 Week Price Change
19.29
52 Week Gain
99.37%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
May 5. 2017
15.24
Jun 6. 2017
17.27
21 Trading Days
13.37%
Link
LONG
Aug 30. 2017
15.93
Oct 16. 2017
18.53
32 Trading Days
16.33%
Link
LONG
Jul 8. 2019
14.11
Aug 2. 2019
15.78
19 Trading Days
11.82%
Link
LONG
Sep 3. 2019
18.35
Sep 24. 2019
19.30
15 Trading Days
5.19%
Link
LONG
Nov 7. 2019
20.28
Nov 21. 2019
21.59
10 Trading Days
6.45%
Link
LONG
Nov 13. 2020
19.73
Dec 15. 2020
23.89
21 Trading Days
21.09%
Link
LONG
Mar 15. 2021
26.27
Apr 13. 2021
30.86
20 Trading Days
17.45%
Link
LONG
May 24. 2021
29.82
Jun 18. 2021
33.04
18 Trading Days
10.77%
Link
Company Information
Stock Symbol
IMOS
Exchange
NasdaqGS
Company URL
http://www.chipmos.com.tw
Company Phone
88635770055
CEO
Shih Chieh Cheng
Headquarters
-
Business Address
NO. 1, R&D ROAD 1,, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN, TAIWAN, PROVINCE OF CHINA 300
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor Equipment & Materials
CIK
0001133478
About

ChipMOS Technologies, Inc. engages in the provision of semiconductor testing and packaging solutions. Its products include testing services, assembly services, gold bumping services, enabling technology, and eService. The company was founded on July 28, 1997 and is headquartered in Hsinchu, Taiwan.

Description

ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision IC products. The company provides a range of back-end testing and assembly services for semiconductor memory and mixed-signal products; and technical and assembly services for liquid crystal display driver IC products. It also offers various technologies, including lead frames and organic substrate carriers for the use in personal computers, networks/communications, office automation, and consumer electronics. In addition, the company engages in wafer bumping services; and manufacturing of memory modules. It serves semiconductor design houses, integrating device manufacturers, and semiconductor fabs in Taiwan, Singapore, the United States, Japan, Korea, Hong Kong, and other countries. The company was founded in 1997 and is based in Hsinchu, Taiwan.