Daily Stock Analysis, IMOS, ChipMOS Technologies Inc, priceseries

ChipMOS Technologies Inc. Daily Stock Analysis
Stock Information
Open
16.60
Close
16.76
High
16.76
Low
16.60
Previous Close
16.71
Daily Price Gain
0.05
YTD High
17.08
YTD High Date
Jan 2, 2019
YTD Low
15.70
YTD Low Date
Jan 10, 2019
YTD Price Change
-0.27
YTD Gain
-1.59%
52 Week High
18.41
52 Week High Date
Dec 3, 2018
52 Week Low
12.26
52 Week Low Date
Oct 30, 2018
52 Week Price Change
0.17
52 Week Gain
1.00%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
May 5. 2017
17.08
Jun 6. 2017
19.36
21 Trading Days
13.37%
Link
LONG
Aug 30. 2017
17.85
Oct 16. 2017
20.77
32 Trading Days
16.33%
Link
Company Information
Stock Symbol
IMOS
Exchange
NasdaqGS
Company URL
http://www.chipmos.com.tw
Company Phone
88635770055
CEO
Shih Chieh Cheng
Headquarters
-
Business Address
NO. 1, R&D ROAD 1,, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN, TAIWAN, PROVINCE OF CHINA 300
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor Equipment & Materials
CIK
0001133478
About

ChipMOS Technologies, Inc. engages in the provision of semiconductor testing and packaging solutions. Its products include testing services, assembly services, gold bumping services, enabling technology, and eService. The company was founded on July 28, 1997 and is headquartered in Hsinchu, Taiwan.

Description

ChipMOS TECHNOLOGIES INC. researches, develops, manufactures, and sells high integration and high precision IC products. The company provides a range of back-end testing and assembly services for semiconductor memory and mixed-signal products; and technical and assembly services for liquid crystal display driver IC products. It also offers various technologies, including lead frames and organic substrate carriers for the use in personal computers, networks/communications, office automation, and consumer electronics. In addition, the company engages in wafer bumping services; and manufacturing of memory modules. It serves semiconductor design houses, integrating device manufacturers, and semiconductor fabs in Taiwan, Singapore, the United States, Japan, Korea, Hong Kong, and other countries. The company was founded in 1997 and is based in Hsinchu, Taiwan.