Daily Stock Analysis, CCMP, Cabot Microelectronics Corp, priceseries

Cabot Microelectronics Corp. Daily Stock Analysis
Stock Information
Open
126.65
Close
125.44
High
127.50
Low
124.93
Previous Close
126.74
Daily Price Gain
-1.30
YTD High
128.37
YTD High Date
Apr 18, 2019
YTD Low
87.72
YTD Low Date
Jan 3, 2019
YTD Price Change
30.51
YTD Gain
32.14%
52 Week High
128.37
52 Week High Date
Apr 18, 2019
52 Week Low
81.93
52 Week Low Date
Dec 24, 2018
52 Week Price Change
24.20
52 Week Gain
23.90%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
Sep 11. 2017
70.37
Nov 9. 2017
91.81
43 Trading Days
30.47%
Link
LONG
Mar 2. 2018
100.73
Mar 22. 2018
110.43
14 Trading Days
9.63%
Link
LONG
May 3. 2018
103.20
May 18. 2018
109.60
11 Trading Days
6.20%
Link
LONG
Feb 20. 2019
104.28
Mar 6. 2019
110.24
10 Trading Days
5.72%
Link
Company Information
Stock Symbol
CCMP
Exchange
NasdaqGS
Company URL
http://www.cabotcmp.com
Company Phone
6303755461
CEO
David H. Li
Headquarters
Illinois
Business Address
870 NORTH COMMONS DRIVE, AURORA, IL 60504
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor - Integrated Circuits
CIK
0001102934
About

Cabot Microelectronics Corp. engages in the development, manufacture and sale of chemical mechanical planarization consumables products. It produces and sells CMP slurries for polishing many of the conducting, insulating and isolating materials used in integrated circuit devices, and also for polishing the disk substrates and magnetic heads used in hard disk drives. The company was founded William P. Noglows in October 1999 and is headquartered in Aurora, IL.

Description

Cabot Microelectronics Corporation, together with its subsidiaries, develops, manufactures, and sells polishing slurries and pads used in the manufacture of advanced integrated circuit (IC) devices in the semiconductor industry in a process called chemical mechanical planarization (CMP). The CMP technology is a polishing process used by IC device manufacturers to planarize or flatten the multiple layers of material that are deposited upon silicon wafers. The company offers CMP slurries, which are liquid solutions composed of high-purity deionized water, proprietary chemical additives, and engineered abrasives that chemically and mechanically interact with the surface material of the IC device at an atomic level; and CMP pads that are engineered polymeric materials designed to distribute and transport the slurry to the surface of the wafer and distribute it evenly across the wafer. Its CMP slurries are used for polishing various materials that conduct electrical signals, including tungsten, copper, tantalum, and aluminum; and certain materials that are used in the production of rigid disks and magnetic heads for hard disk drives, as well as used in the dielectric insulating materials that separate conductive layers within logic and memory IC devices. The company also designs and produces precision polishing and metrology systems to attain near-perfect shape and surface finish on various optical components, such as mirrors, lenses, and prisms. It serves the producers of logic IC devices or memory IC devices, and providers of IC foundry services directly, as well as through distributors. The company operates in the United States, Asia, and Europe. Cabot Microelectronics Corporation was founded in 1999 and is headquartered in Aurora, Illinois.