Daily Stock Analysis, ASX, Advanced Semiconductor Engineering Inc, priceseries

Advanced Semiconductor Engineering Inc. Daily Stock Analysis
Stock Information
Open
6.58
Close
6.54
High
6.59
Low
6.54
Previous Close
6.46
Daily Price Gain
0.08
YTD High
6.59
YTD High Date
Mar 24, 2017
YTD Low
5.04
YTD Low Date
Jan 3, 2017
YTD Price Change
1.45
YTD Gain
28.49%
52 Week High
6.59
52 Week High Date
Mar 24, 2017
52 Week Low
4.21
52 Week Low Date
May 19, 2016
52 Week Price Change
1.06
52 Week Gain
19.38%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
Oct 14. 2015
5.18
Oct 29. 2015
5.57
11 Trading Days
7.42%
Link
LONG
Feb 16. 2016
5.02
Mar 7. 2016
5.48
14 Trading Days
9.23%
Link
LONG
May 23. 2016
4.52
Jun 10. 2016
5.36
13 Trading Days
18.60%
Link
LONG
Jul 14. 2016
5.34
Aug 19. 2016
5.89
26 Trading Days
10.19%
Link
LONG
Jan 24. 2017
5.44
Mar 1. 2017
6.09
25 Trading Days
11.98%
Link
Company Information
Stock Symbol
ASX
Exchange
NYSE
Company URL
http://www.aseglobal.com
Company Phone
KAOHSIUNG TAIWAN F5 00000
CEO
Hung Pen Chang
Headquarters
-
Business Address
-
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor Equipment & Materials
CIK
0001122411
About

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally.

Description

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, Europe, and internationally. It operates through Packaging, Testing, and Electronic Manufacturing Services segments. The company offers packaging services, including various packages, such as flip-chip ball grid array (BGA), flip-chip chip scale package, advanced chip scale packages, quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions. It also provides advanced packages, including wafer level chip scale, flip-chip (FC) chip scale, FC package in, FC BGA/HF FCBGA, FC and wire bonding, and integrated passive device packages; IC wire bonding packages, including lead frame-based package types, such as lead frame-based packages and substrate-based packages; system-in-package (SiP) products, as well as module assembly services; and interconnect materials. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/ MEMS/discrete final testing, and test-related services, as well as drop shipment services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications. Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan.