Daily Stock Analysis, AMLP, Amkor Technology Inc, priceseries

Amkor Technology Inc. Daily Stock Analysis
Stock Information
Open
12.49
Close
12.54
High
12.61
Low
12.46
Previous Close
12.48
Daily Price Gain
0.06
YTD High
13.24
YTD High Date
Feb 16, 2017
YTD Low
12.41
YTD Low Date
Jan 10, 2017
YTD Price Change
0.02
YTD Gain
0.13%
52 Week High
13.24
52 Week High Date
Feb 16, 2017
52 Week Low
9.40
52 Week Low Date
Mar 29, 2016
52 Week Price Change
2.84
52 Week Gain
29.30%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
Oct 1. 2015
11.64
Oct 13. 2015
12.28
8 Trading Days
5.55%
Link
LONG
Dec 21. 2015
9.74
Jan 6. 2016
10.27
10 Trading Days
5.49%
Link
LONG
Feb 25. 2016
9.10
Mar 8. 2016
9.63
8 Trading Days
5.85%
Link
Company Information
Stock Symbol
AMLP
Exchange
NasdaqGS
Company URL
http://www.amkor.com
Company Phone
480-821-5000
CEO
Stephen Douglas Kelley
Headquarters
Arizona
Business Address
2045 EAST INNOVATION CIRCLE, TEMPE, AZ 85284
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor - Integrated Circuits
CIK
0001047127
About

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer backgri...

Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer backgrinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; flip chip ball grid array (BGA) products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages. In addition, it offers leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages that are used to connect a die to a substrate; micro-electro-mechanical systems packages that are miniaturized mechanical and electro-mechanical devices; and system-in-package modules, which are used in RF and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries, as well as communications, consumer, networking, computing, and automotive and industrial markets. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.