Daily Stock Analysis, AMLP, AMKOR TECHNOLOGY INC, priceseries

AMKOR TECHNOLOGY INC. Daily Stock Analysis
Stock Information
Open
28.97
Close
27.95
High
29.04
Low
27.70
Previous Close
28.91
Daily Price Gain
-0.96
YTD High
30.12
YTD High Date
Jan 14, 2021
YTD Low
25.23
YTD Low Date
Jan 4, 2021
YTD Price Change
2.51
YTD Gain
9.87%
52 Week High
38.51
52 Week High Date
Jan 22, 2020
52 Week Low
10.99
52 Week Low Date
Mar 18, 2020
52 Week Price Change
-9.76
52 Week Gain
-25.87%
Recent priceSeries Trade Signals

These are sample algorithmic trades based on actual market data.

Trade Type
Entry Date
Entry Price
Exit Date
Exit Price
Trade Hold Time
Gain
Trade Record
LONG
Jul 18. 2018
40.83
Aug 15. 2018
43.86
20 Trading Days
7.43%
Link
LONG
Jan 3. 2019
36.57
Jan 22. 2019
39.44
12 Trading Days
7.86%
Link
LONG
Dec 9. 2019
35.44
Dec 30. 2019
37.55
14 Trading Days
5.96%
Link
LONG
Apr 2. 2020
16.19
May 13. 2020
21.64
28 Trading Days
33.67%
Link
LONG
May 15. 2020
22.63
Jun 11. 2020
26.03
18 Trading Days
15.01%
Link
LONG
Nov 13. 2020
23.01
Nov 30. 2020
25.27
10 Trading Days
9.81%
Link
LONG
Jan 5. 2021
26.49
Jan 21. 2021
28.31
11 Trading Days
6.88%
Link
Company Information
Stock Symbol
AMLP
Exchange
NASDAQ
Company URL
http://www.amkor.com
Company Phone
480-821-5000
CEO
Stephen Douglas Kelley
Headquarters
Arizona
Business Address
2045 EAST INNOVATION CIRCLE, TEMPE, AZ 85284
Sector
Equity
Industry Category
Electronics
Industry Group
Semiconductor - Integrated Circuits
CIK
0001047127
About

Amkor Technology, Inc. provides contract semiconductor assembly and test services. The company was founded in 1986 and is headquartered in Tempe, AZ.

Description

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip and other interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; flip chip ball grid array (BGA) products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages. In addition, it offers leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and system-in-package modules, which are used in radio frequency and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.